OOFELIE::Multiphysics for Robust Microsystems Design

MEMS and MOEMS revolutionize the transducer industry in terms of the very small component size, product reliability and reduced production costs. The continuously decreasing size makes a strongly coupled multiphysics simulation approach mandatory to obtain accurate and quick results.

When your microsystems need high dimensional stability, increased accuracy and reliable performances, the OOFELIE::Multiphysics Suite is the right solution for you.

Broad application coverage

  • Capacitive effect – Electrostatics coupled to mechanics
    • Accelerometers
    • Gyrometers
    • Optical MEMS (static actuation)
    • RF switches
  • Piezoresistivity (change of resistivity with mechanical stresses)
    • Pressure sensors
    • Strain gauge
  • Thermomechanical effect  – Temperature coupled to mechanics
    • Temperature sensors
    • Thermo-couple
    • IR-sensors (micro-bolometer)
    • Vibrating sensors
  • Vibro-acoustics  – acoustic pressure coupled with mechanics
    • micro-loudspeakers
    • micro-microphones
    • Sonar
  • Piezoelectric effect
    • Accelerometers
    • Gyrometers
    • Optical MEMS (resonant actuation)
    • SAW – Surface acoustic wave
    • BAW – Bulk acoustics wave
    • Energy harvester (from mechanical vibration)
    • Sonar
  • Magnetic effect (coupled with mechanics)
    • Magnetic actuators
  • Semiconductor effect – Thomson, Seebeck & Peltier
    • Thermoelectric  generator (harvester based on temperature gradient)
    • Peltier cooler
  • FSI
    • Thermal management (conjugated heat transfer)
    • Flow sensor

An automated multiphysics FEA solution

The  OOFELIE::Multiphysics Solver is a 3D strongly coupled multiphysics Finite Element Analysis (FEA) solution used to model, simulate, analyse and optimize various types of systems before starting the time consuming and costly build-and-test cycles. The automated exploration of the design space allows to identify the appropriate design by using:

  • Parametric studies and Design of Experiments
  • Optimization strategies

Connected to the Tanner MEMS design flow

The OOFELIE::Multiphysics Suite is tightly linked with SoftMEMS‘s MEMS Pro® for connection to the Tanner MEMS design flow:

  • Model importation using MEMSPro® from SoftMEMS
  • Model exportation to EDA solver using Verilog-A or VHDL-AMS exchange


 Exportation of a compact model to Mentor Graphics’s Tanner EDA

Interaction with the package

With the OOFELIE::Multiphysics Solver, you can predict the behaviour of your transducer and the interaction with its package. Doing so allows to analyse the effect of the package on the sensitive component from the early stage of its conception minimizing therefore the risk of failure. In the system formed by the sensors, its substrate and its package, the OOFELIE::Multiphysics Suite gives you the opportunity to:
  • Evaluate the temperature distribution
  • Evaluate the mechanical and thermal stresses/deformations distribution
  • Evaluate adhesion or contact forces
  • Reproduce thermal cycling
  • Reproduce drop test
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