Simulation of robust transducers by design
The OOFELIE::Multiphysics Solver is a 3D strongly coupled multiphysics Finite Element Analysis (FEA) solution used to model, simulate, analyze, and optimize various types of systems before starting the time consuming and costly build-and-test cycles.
By design, OOFELIE::Multiphysics manages several physics and their couplings. Its robust and efficient simulation methodologies are based on a combination of discretization technics (FEM, BEM, …) when appropriate.
Broad application coverage
The OOFELIE::Multiphysics Solvers contains several physics and couplings between them. This gives you the opportunity to analyze your design from different points of view with the same engineering software tool.
- Capacitive effect – Electrostatics coupled to mechanics
- Accelerometers
- Gyrometers
- Optical MEMS (static actuation)
- RF switches
- Piezoresistivity (change of resistivity with mechanical stresses)
- Pressure sensors
- Strain gauge
- Thermomechanical effect – Temperature coupled to mechanics
- Temperature sensors
- Thermo-couple
- IR-sensors (micro-bolometer)
- Vibrating sensors
- Vibro-acoustics – acoustic pressure coupled with mechanics
- micro-loudspeakers
- micro-microphones
- Sonar
- Piezoelectric effect
- Accelerometers
- Gyrometers
- Optical MEMS (resonant actuation)
- SAW – Surface acoustic wave
- BAW – Bulk acoustics wave
- Energy harvester (from mechanical vibration)
- Sonar
- Magnetic effect (coupled with mechanics)
- Magnetic actuators
- Semiconductor effect – Thomson, Seebeck & Peltier
- Thermoelectric generator (harvester based on temperature gradient)
- Peltier cooler
- FSI
- Thermal management (conjugated heat transfer)
- Flow sensor
An automated multiphysics FEA solution
The automated exploration of the design space allows to identify the appropriate design by using:
- Parametric studies and Design of Experiments
- Optimization strategies
OOFELIE::Multiphysics link to Simcenter 3D
Connected to the Siemens MEMS design flow
- Model importation using MEMSPro® from SoftMEMS
- Model exportation to EDA solver using Verilog-A or VHDL-AMS exchange
The OOFELIE::Multiphysics Solver is operated from Simcenter 3D, the simulation environment of SIEMENS. This integrated solution provides strongly coupled multidisciplinary analysis of a broad range of transducers, MEMS, microsystems, and optical devices products in the aeronautics, space, defense, automotive, shipbuilding, and consumer electronics markets
Interaction with the package
With the OOFELIE::Multiphysics Solver, you can predict the behavior of your transducer and the interaction with its substrate and/or its package. Doing so allows analyzing the effect of the package on the sensitive component from the early stage of its conception minimizing therefore the risk of failure.
In the system formed by the sensors, its substrate, and its package, the OOFELIE::Multiphysics Suite gives you the opportunity to:
- Evaluate the temperature distribution
- Evaluate the mechanical and thermal stresses/deformations distribution
- Evaluate adhesion or contact forces
- Reproduce thermal cycling
- Reproduce drop test
- …
Applications
